Wafer bumper for the Silicon Austria Labs – Chips JU
Art des Dokuments
Vergebener Auftrag
Veröffentlicht am
03.06.2026
Ort der Leistungserbringung
9524 Villach (Kärnten)
Gewerke
Laborausrüstung
Kurzbeschreibung
The aim of this procurement procedure is to award the contract to the best bidder identified during the procurement procedure for the supply, installation and commissioning of an automated wafer soldering bumping tool as well as services such as trainings for Silicon Austria Labs GmbH.